Coat Developer Equipment

8 & 6 inches or compatible

  • Applicable wafer size: 8 & 6 inches or compatible
  • Equipment size: 1850*1700*2600mm (Single block)
    3110*1700*2500mm (Open-type dual block)
  • Warping degree: ±1mm
  • Application fields: Silicon based, silicon carbide, gallium nitride, filters, gallium arsenide, advanced packaging and other fields

Product Advantages:

  1. Able to support flexible customization of multiple units
  2. Able to support I-Line lithography machine and KRF process
  3. Able to support composite boards and circulating water temperature control cooling boards
  4. Able to support digital collection of process parameters
  5. Able to support remote monitoring system
  6. Able to support the EAP system

Technical Parameter:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±0.2℃
  8. Applicable photoresist: Max20000CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Fin flow/ ultrasonic flowmeter

Independent research and development

  • Software Running
  • Mechanical Transmission
  • Circuit Module
  • Unit for Coating
Compound Semiconductor

Process capacity: > 0.18um
Products: Gallium Arsenide (GaAs),
Gallium Nitride (GaN),
Silicon Carbide (SiC), Filter (Filter)

Microcomputer
Semiconductor

Process capacity: > 0.18um
Product: MEMS

Silicon-based Semiconductor

Process capacity: > 90nm
Products: IGBT, CMOS, MPU, MCU,
DSP, RAM, ROM, Flash