Necessary equipment for semiconductor chip manufacturing


Coat Developer Equipment

ZHT-200, 8 & 6 inches or compatible

  • Applicable wafer size: 8 & 6 inches or compatible
  • Equipment size: 1850*1700*2600mm (Single block)
    3110*1700*2500mm (Open-type dual block)
  • Warping degree: ±1mm
  • Application fields: Silicon based, silicon carbide, gallium nitride, filters, gallium arsenide, advanced packaging and other fields

Product Advantages:

  1. Able to support flexible customization of multiple units
  2. Able to support I-Line lithography machine and KRF process
  3. Able to support composite boards and circulating water temperature control cooling boards
  4. Able to support digital collection of process parameters
  5. Able to support remote monitoring system
  6. Able to support the EAP system

Technical Parameters:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±0.2℃
  8. Applicable photoresist: Max20000CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor/Fin flow/ ultrasonic flowmeter


Coat Developer Equipment

ZHT-150

  • Applicable wafer size: 6 & 4 inches or compatible
  • Equipment size: 1750*1820*2850mm
  • Warping degree: ±0.3mm
  • Application fields: optical communication, compound semiconductors, power devices, Micro LEDs, etc

Product Advantages:

  1. Integrated design, with small equipment footprint and high stability
  2. Able to support G-line and I-Line processes
  3. Customized function development can be carried out according to customer requirements
  4. Localization of components with high cost-effectiveness
  5. Able to support SECS communication

Technical Parameters:

  1. Speed range: 0-6000rpm
  2. Acceleration range: 0-50000rpm/sec
  3. Speed accuracy: ± 1rpm
  4. Hot plate temperature range: 50-200 ℃
  5. Temperature uniformity of hot plate:
    50.0℃ ~ 120.0℃ : Range ≤ 0.4℃
    120.1℃ ~ 150.0℃ : Range ≤ 0.8℃
    150.1℃ ~ 200.0℃ : Range ≤ 1.2℃
  6. Cold Plate Temperature Range: 20-30℃
  7. Uniformity of cold plate temperature: ±2℃
  8. Applicable photoresist: Max 800CP
  9. Rubber pump type: Cylinder/Motor Type pump
  10. Photoresist or developer tubing: PFA
  11. Traffic monitoring: Flowmeter + Contra ejaculation sensor


Coat Developer Equipment

ZHT-300, 12&8inch

Application fields: Silicon based PI technology, advanced packaging and other fields.

Product advantages:

  1. Connecting to the lithography machine and complete the automated production of the lithography process
  2. Meeting the high-precision process requirements with self-developed high-precision cold and hot plates
  3. Compatible with both products 200mm/300mm
  4. Stacked structural layout with high output per unit area
  5. Able to support SECS communication and AMHS system
  6. Able to configure equipment according to customer requirements
  7. Localization of components, reducing costs significantly

Vertical Furnace

ZHL-200, 8～6inch

(Vertical furnace)

Size: 900 x 1900 x 3060mm

Widely used in silicon-based, compound semiconductors, filters, advanced packaging, power devices, Micro LEDs and other fields.

Technical Parameters:

  1. Wafer size: 200mm. (or 150mm)
  2. Batch size: 150wafers/1tube
  3. Process pressure: atmospheric pressure/low pressure
  4. Power consumption: MAX 3Φ, 480VAC, 200A, 60Hz
  5. Cooling water：5kgf/cm2
  6. Exhaust system: 1500CFM
H2 Anneal Dry/Wet Oxidation Alloy
Forming Gas
Anneal		 Hi temp process (max 1300℃) LTO
TEOS Nitride Poly


RTP

ZHR-200, 8～6inch

Size: 1200 x 1730 x 2045mm

>Widely used in silicon-based, compound semiconductors, filters, advanced packaging, power devices, Micro LEDs and other fields.

Product Advantages:

  1. Temperature range: 400~1300℃
  2. SEMI S2 certification, including toxic gas options, using NH3 for advanced applications
  3. Halogen lamp series: Max 1200deg.C
  4. Best Environmental Control <2ppm O2 – Low concentration treatment with high TPT
  5. Occupied area 1.8m²- High utilization of clean room space and high wafer yield per unit area
  6. Communication Protocol – Fast, Easy, and Efficient Maintenance
No stage Purpose Quantity Slot Technical parameters note
1 Cassette Stage A, B Cassette 6” or 8” 2 25(26) 1) Detection Sensor by Cassette Size
2) Wafer Slide Detection Sensor		 –
2 Wafer Aligner Wafer Centering 1 1 1) Drive by Air Cylinder2) Wafer Detection Sensor3) Chuck Material : Peek –
3 Robot Wafer Conveying 1 1 1) Wafer Detection Sensor (Vaccum)2) Chuck Material : Peek –
4 Dummy Stage Dummy Wafer Stock 1 2 1) Stage Material : POM –
5 Cool Stage A, B Wafer Cooling 2 1 1) Cooling Method : Cooling Water2) Wafer Detection Sensor3) Drive by Air Cylinde4) Stage Material : SUS 3045) Pin Material : Quartz –
6 Wafer Stock Susceptor Stock Slot 1 5 1) 5-Slot (6:” Wafer)2) Material : POM SPECIAL OPTION

Single wafer Scrubber clean tool

ZHS-200, 8~6inch

4 positive configurations WPH ＞160 pieces
2 positive and 2 negative configurations WPH ＞100 pieces

Application fields:

Silicon based, compound semiconductors, filters, advanced packaging, power devices, Micro LEDs and other fields.

Product advantages:

  1. High quality – CLASS 10 environmental level; Static elimination system
  2. Diversity – different cleaning methods meet the needs of different processes
  3. Customization – configure according to customer needs
  4. Progressiveness – the latest operating system, software function diversity


Single wafer Scrubber clean tool

ZHS-300, 12～8inch

8 positive configurations WPH ＞380 pieces
4 positive and 4 negative configurations WPH ＞200 pieces

Application fields:

Silicon based, compound semiconductors, filters, advanced packaging, power devices, Micro LEDs and other fields.

Product advantages:

  1. High quality – CLASS 10 environmental level; Static elimination system
  2. Diversity – different cleaning methods meet the needs of different processes
  3. Customization – configure according to customer needs
  4. Progressiveness – the latest operating system, software function diversity